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Edited by: Jörg Franke

Three-Dimensional Molded Interconnect Devices (3D-MID)

Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
(Geprüfte Bewertung)
139.99 € 
published
Published 04/2014 PDF

Gottfried Wilhelm Ehrenstein Gabriela Riedel Pia Trawiel

Thermal Analysis of Plastics

Theory and Practice
(Geprüfte Bewertung)
199.99 € 
published
Published 11/2012 PDF

Susan E.M. Selke John D. Culter Rafael A. Auras Muhammad Rabnawaz

Plastics Packaging

Properties, Processing, Applications, and Regulations
(Geprüfte Bewertung)
169.99 € 
published
Published 05/2021 Print | PDF

Markus Schubnell

Validation in Thermal Analysis

(Geprüfte Bewertung)
149.99 € 
published
Published 08/2022 Print | PDF
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