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Edited by: Jörg Franke

Three-Dimensional Molded Interconnect Devices (3D-MID)

Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
(Geprüfte Bewertung)
139.99 € 
published
Published 04/2014 PDF

Meng-Jiao Wang Michael Morris

Rubber Reinforcement with Particulate Fillers

(Geprüfte Bewertung)
219.99 € 
published
Published 08/2021 Print | PDF