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Edited by: Jörg Franke

Three-Dimensional Molded Interconnect Devices (3D-MID)

Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
(Geprüfte Bewertung)
139.99 € 
published
Published 04/2014 PDF

Hans-Leo Ross Ole Hans Krystian Radlak

Vehicle Safety and Future Mobility

Social, Legal and Safety Solutions
(Geprüfte Bewertung)
249.99 € 
available for pre-order
Erscheint: 09/2025 Print