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Edited by: Jörg Franke, 

Three-Dimensional Molded Interconnect Devices (3D-MID)

Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
(Geprüfte Bewertung)
139.99 € 
published
Published 04/2014 PDF
See product description

Alphonsus V. Pocius, 

Adhesion and Adhesives Technology

An Introduction
(Geprüfte Bewertung)
199.99 € 
published
Published 03/2021 Print | PDF
See product description